CV of Researcher / Leader, manager , looking for a job of Project leader, R&D, new products, process improvement / seniors.enligne-dk.com

Current industry: University

Size of the company: 101-1000 employees

Current position: Researcher

Number of years spent at this position: 6-10 years

Number of persons you managed: 1-5 persons

Annual salary: 0.00 EUR

Total working experience: more than 15 years

Availability: Immediate availability

Positions: leader, manager, senior engineering, R&D

Industry: Semiconductors, Sensors and MEMS, Research

Desired type of contract: open-ended contract, fixed term contract, Fixed-term / casual work, Temporary work, Agent's contract

Desired working time: Full-time, Part-time, Study-work program, One-day assignments, Seasonal work, Available on Week-ends

Minimum annual salary desired: 0.00 / 0.00 EUR

Highest educational level completed: number of years studied and completed with a diploma after highschool : +11

Last diploma : PhD in Applied Science

Current educational level : +11

Other training courses :

Geographical mobility: Country : Belgium, Canada, Denmark, Finland, France, Germany, Luxembourg, Netherlands, Sweden, Switzerland, United Kingdom

Known Tools / Software/ Methods Wafer fabrication processing for semiconductors, sensors and MEMS. Quality assurance, Process improvement. Semiconductors physics. Project leader and management. Device packaging. Electronics. Chemical engineering

HGV, LGV, special vehicles licences

Languages French : Advanced
English : Fluent
Spanish : Native
Dutch : Basic

Mr. Lu... M...

....

1040 Brussels
Belgium

LANGUAGES: Spanish, English, French



EDUCATION
1.- PhD
in Applied Science from Université Catholique de Louvain - Louvain-La-Neuve,
Belgium, September
2002 – July 2007.

Thesis Title: “Anodic
Aluminum Oxide Processing, Characterization and Application to DNA
Hybridization Electrical Detection”.

2.- Master in Administration
from Université Catholique de Louvain, Louvain-La-Neuve, Belgium, September
2006 – August 2008.

3.- Master of Science in
Electrical Engineering from CINVESTAV-IPN - Guadalajara, Jalisco, México, January
1997 - December 1999.

4.- Bachelor in Chemical
Engineering from Universidad Autónoma de Guadalajara, Guadalajara, Jalisco,
Mexico, August 1984 - January 1989.



COURSES
1.- Electroplating and
Surface Finishing Training Course, American Electroplaters and Surface
Finishers, Cleveland, Ohio, USA, June 1997.

2.- Training the Trainer, Motorola
University, Chicago, Illinois, USA, September 1996

3.- MFG-452 Lead Finish
Course, Motorola University, Hong
Kong, July 1995.

4.- Project Management, Motorola
University, Guadalajara, Jalisco, México, September 1994

5.- Machine/Process
Capability Study Course, Motorola, Guadalajara, Jalisco, México, August 1993

6.- Design of Experiments, Motorola,
Guadalajara, Jalisco, México, March 1993

7.- Statistical Process
Control Diploma, Tecnologico de
Monterrey, Guadalajara, Jalisco, México, March 91 - December 91



WORK EXPERIENCE


Company: Université Catholique de Louvain

Product: MEMS and Sensors (SOI)

Job Title: Research Assistance

Department: DICE

Date: October 2001 – December 2011

Activities: Biosensors (DNA sensors) and MEMS design
and fabrication, Study of SEU effects on Diodes, Fire Sensors, process design
and fabrication, Process and Device simulation, CMOS, Evaporation process
characterization, Research and Development, Project Spin-Off SENSOI, sensors
commercialization in medical and environmental applications.



Company: On Semiconductors / Motorola de Mexico, S.A.

Product: Semiconductors, Wafer and Assembly

Job Title: Rectifiers Device Engineer

Department: Rectifier Wafer Fab

Date: November 1998 – October 2001

Activities: Rectifier fab transfer to GDL, Project
leader, Schottky device qualification, Process Improvement, New Products
Introduction, Problem Solving (DOE, SPC, 8 disciplines, Statistical Tools), Research
and Development, all work applied in silicon wafer manufacturing processes.



Company: Motorola
de Mexico, S.A.

Product: Semiconductors, Wafer and Assembly

Job Title: Process Engineer, Lead Finish and Die
Attach Technologies

Department: Central Engineering

Date: September 92 – November 98

Activities: Project leader, SPC Implementation, Process
Improvement, New Products Introduction, Problem Solving (DOE, SPC, 8
disciplines, Statistical Tools), Research and Development, All work applied in
the following processes: Lead finish, Die Attach, Wire Bond, Cleaning and
Surface Mount (Solder Printing and Reflow).



COMPUTER SKILLS:

Software: Word, Excel, Power Point, Jump, Project,
Lotus, and Dbase.

Programming: Basic and Pascal

Simulation: AIMSPICE, PSPICE, ATHENA and ATLAS.



CONTRIBUTIONS and AWARDS:



1.- Technical Excellence Awards for the following
projects (Issued by Motorola):

G090 Stronger Flux for Copper Leads.

G100 2 Amp Optocoupler Barrel Plating.

G118 Bad Solder Joints Elimination

G121 Minibus Solder Dipping Machine Characterization For TO-220.

G127 Advantages Of Phosphorus Content on Nickel Plated Alloy In
Surface Mounting Technology Assy.

G151 High Purity Level, Oxides Free 63 Sn/37 Pb Solder Bar (Hi-Flo) on Solder Dipping Evaluation.

G168 Shunt Resistor PR Adjustment on HPM Pick and Place Proc.

G178 Solder Splashes Elimination on Hpm Front End.

G188 Thickness Problem Reduction on The Plating Shop - Faraday's Law
Application.

G189 Rotation Direction Effect On Pfi Yield Loss On Barrel Plating.

G211 Micro Cracks Problem Reduction on Hpm Pick and Place.

G212 D.I. Water Reuse Modification on the Plating Shop .

G229 Tin/Lead Semi-Auto Releaser System for Ballast Recovery Process
in the Plating Shop.

G241 D2pak Tin/Lead Barrel Plating Qualification.

G242 Reduction of Igss Problem Due To Cratering On Hpm Wire Bonding
Process.

G252 Vibratory Plating Line, Black Stains Problem Reduction.

G283 MSA Tin/Lead Plating Solution System, Characterization on
Surmetics and Zeners Barrel Plating Lines .

G288 Cost Reduction on TO-3 Solder Dipping Operation, Flux 260-HF
Qualification.

G307 Reduce Rinsing and Cost Reduction on TO-220 Solder Dipping
Operation, Flux Water Soluble Qualification.

G314 TO-264 Transference Qualification Assembly and Test Technical
Report.

G327 Peeling Problem on TO-220 Lead Frames,
Nickel-Solder Intermetallic Effect.

G329 TO264 Rack Plating Qualification.

G332 TO264 Transference Project Preliminary Report.

G365 Solder Paste Characteristics Effect on Thyristor Clip Physical
and Electrical Performance.

G373 Temperature Peak and Cleaning Process Effect on Thyristor
Electrical Performance.

G374 Die Pad Concavity Effect on Thyristor Clip Voids And Electrical
Performance.

G375 Membranes Thickness Variation Effect onto Dispensed Solder
Paste Volume.

G376 Three Pistons vs Time-Pressure Dispenser In-Time Consistency
Comparison.

G377 Ovens Profiling Variation For The Power Thyristor Automation
Project.



2.- Reuse of Technology Awards for the following
projects (Issued by Motorola):

G151 High Purity Level, Oxides Free 63 Sn/37 Pb Solder Bar (Hi-Flo) on Solder Dipping Evaluation.

G242 Reduction of Igss Problem Due To Cratering On The HPM Wire
Bonding Process.

G329 TO-264 Rack Plating Qualification.



Note: All technical reports were published at
Motorola Intranet.



3.- Patens
& Publications:



Conference Proceedings:

[S1]
“Edge Effects and Tilt Dependency of Heavy Ion
Irradiation SEE Characterization In PN junctions”; RADECS conference Padova,
It, September 2002.

[S2]
“Integrated Low-Cost Micro-Sensors for DNA Sensitive
Electrical Detection”, ASM Conference on Bio-, Micro-, and Nanosystems, New
York, NY, July 7-10, 2 posters, 2003.

[S3]
“DNA electrical detection based on inductor resonance
frequency in standard CMOS technology”, 33rd European Solid-State Device
Research Conference – ESSDERC 2003, Estoril, Portugal, Sept. 16-18, pp.
171-174, 2003.

[S4]
“DNA Detection Based On Capacitive Al₂0₃/Al
Microelectrodes”, IEEE MEMS 2004 Conference Proceedings, Pages 308-311, January
2004.

[S5] “High-Voltage High-Current DMOS Transistor Compatible with
High-Temperature Thin-Film SOI CMOS Applications”, Proceedings of the NATO
Advanced Research Workshop on Science and Technology of
Semiconductor-On-Insulator Structures and Devices Operating in a Harsh
Environment, NATO Science Series, II., Vol. 185, pp. 279-284, Kiev, Ukraine,
26-30 April, 2004.

[S6]
“Aluminum Anodizing Process Characterization
for DNA Attachment and Electrical Detection”, The Eight international
Conference on Miniaturized Systems for Chemistry and Life Sciences MicroTAS
2004, Malmö, Sweden, 26-30 September 2004.

[S7]
“RF Detection of DNA Based on CMOS Inductive and
Capacitive Sensors”, The 34th European Microwave Conference (EuMC) as part of
the European Microwave Week 2004, Amsterdam, The Netherlands, October 12-14,
2004.

[S8]
“Anodized Aluminum (Al₂O₃)
Metal-Insulator-Metal (MIM) Capacitors for High Temperature Applications”,
International Conference on High Temperature Electronics, HITEN, Paris, France,
6-8 Sep 2005.

[S9]
“DNA analytical CMOS-compatible capacitive”, Fifth
Belgian Day on Biomedical Engineering, invited paper, Brussels, Belgium,
28 Oct 2005.

[S10] "DNA
Hybridization Electrical Detection by 3 Independent Measurements Techniques
Based on Interdigitated Al/Al₂O₃ Capacitors", The
Ninth World Congress on Biosensors, Abstract P380, Toronto, Canada, May 10-12,
2006.

[S11] “On-Chip
RF Detection of DNA Hybridization Based on Interdigitated Al₂O₃
Capacitors”, 36th European Solid-State Device Research Conference – ESSDERC
2006 Proceedings, pp. 125-128, Montreux, Switzerland, 19-21 Sep 2006.



Special Presentations:

[S12] “Nano and micro metal particles for
molecular detection”, International Symposium on Bioconjugated Nanoparticles in
Molecular Diagnostics and Therapy, invited paper, Jena, Germany, 22-24 May
2003.

[S13]
“Micro-Capteurs à faible coût pour la détection électrique d’ADN”, Feynman
Workshop, UCL, Louvain-la-Neuve, Belgium, Septembre 2003.

[S14] “On-chip
DNA electrical detection based on Si-CMOS compatible aluminum capacitors and
inductors coated with metal oxides”, Focused Workshop on Electronic Recognition
of Bio-molecules ERBM, Beckman Institute for Advanced Science and Technology,
University of Liege, Liege, Belgium September 1-3, 2004.

[S15] “Materials Surface and Silanization
Characterization for DNA Attachment”, Feynman Workshop, UCL, Louvain-la-Neuve,
Belgium, February 2005.

[S16] “Investigation of the Electrical Detection of Hybridized DNA
Concentrations lower than 1 nM, based on CMOS Compatible Al Capacitors Coated
with Metal Oxides”, Second Focused Workshop on Electronic Recognition of
Bio-molecules ERBM2, Beckman Institute for Advanced Science and Technology
University of Illinois in Urbana, Illinois, USA September 7-9, 2005.

[S17] “DNA Hybridization Electrical Detection for Concentrations
Lower Than 1nM Target ssDNA, Based on Interdigitated Al/Al₂O₃
Capacitors”, 2th Meeting Cost Action B28 Array Technologies For Bsl3 And Bsl4
Pathogens, Bratislava, Slovakia, November 21-22, 2005.

[S18] “Investigation of Al/Al₂O₃
Interdigitated Structures on Si Biochips Towards the Electrical Detection of
TP53 DNA Single Point Mutations”, Third Focused Workshop on Electronic
Recognition of Bio-molecules ERBM3, Beckman Institute for Advanced Science and
Technology, University of Liege, Liege, Belgium September 6-8, 2006.



Articles in Periodicals:

[S19] “Immobilization of
DNA on CMOS compatible materials”, Sensors and Actuators B, 92, pp. 90-97,
2003.

[S20] “Sensitive DNA
electrical detection based on interdigitated Al/Al₂O₃
microelectrodes”, Sensors and Actuators B: Chemical, Volume 98, Issues 2-3, pp
269-274, 15 March 2004.

[S21] "Comparison of DNA Detection
Methods Using Nanoparticles and Silver Enhancement”, IEE
Proc.-Nanobiotechnology, Vol. 152, No. 1, February 2005.

[S22] “Electrical Detection of DNA Hybridization: Three Extraction Techniques Based
on Interdigitated Al/Al₂O₃ Capacitors”, Biosensors &
Bioelectronics, accepted for publication, Nov 2006.



Patents:

[P1]
Patent Award for the development of the new
package “MP2” developed for surface mount products (Thyristor, rectifiers,
transistors).

[P2]
“Method and device for high sensitivity detection of the presence of
DNA and other probes”, Demande de brevet européen 02447122.9,
deposited date: 24 juin 2002.

[P3]
Patent in transaction, title:
“MIS Field-Effect Sensors”, 2006.

Mr. Lu... M...

....

1040 Brussels
Belgium

Semiconductors, MEMS and sensors manufacturing, design, improvement and R&D. New products development, looking for new applications, feasibility studies, validation. Also as chemical engineering and project leader or quality control senior level.

Hi, what I'm looking for is a new opportunity to keep growing in my career and be able to help improve products, find new applications, do all the engineering to meet new developments. The areas I'm more interested are Semiconductors (vast experience in manufacturing sites as well as in research, especially in Motorola and On semi), sensors and MEMS (that I design and fabricated during my period in the Université catholique de Louvain.
I have preference to work in the industry or research centers where growing opportunities exists. I': very good working with diferent level workers, from managers to operators, handling project and working teams and follow them till the successful ending of it. I'm very good in problem solving, even in new process that I just learn at the moment. I have very good knowledge and experience on 6 sigma, quality, audits, ISO, etc.
So, please consider my CV for your company, I'm sure you will not regret it and it will be succesful for both of us.

Thanks and regards

Luis

Mr. Lu... M